Boeing, Intel join forces on microelectronic for aerospace - Breaking The News
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Boeing, Intel join forces on microelectronic for aerospace

EPA-EFE/FOCKE STRANGMANN

Boeing Company and Intel Corporation announced on Tuesday they agreed to work together on semiconductor technology across the aerospace industry with the goal of developing "next-generation microelectronics applications in artificial intelligence, secure computing and advanced flight capabilities for future products."

The two companies noted they will collaborate to leverage, among others, Intel 18A technology, a "state-of-the-art Si CMOS (Silicon Complementary Metal-Oxide Semiconductor) fabrication process."

"We are excited to work with Intel to accelerate state-of-the-art microelectronics computing technologies to meet the needs of our aerospace customers," said Patty Chang-Chien, vice president and general manager of Boeing Research & Technology. "Bridging advanced commercial technology into aerospace capabilities is one of our core strengths and critical for our national security," she added.

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