Samsung to receive Japan aid to build chip facility - Breaking The News
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Samsung to receive Japan aid to build chip facility

EPA-EFE/JEON HEON-KYUN

Japanese Economy, Trade and Industry Ministry announced on Thursday that will provide up to ¥20 billion ($140 million) in subsidies to Samsung Electronics Co. for the company to build a chip development facility in Yokohama.

The total investment cost for the new Samsung facility is over ¥40 billion ($280 million)and the government money will cover half of it.

The plan will focus on research on "back-end" semiconductor technology, in which chips are assembled and molded, and will study manufacturing technology for high-performance semiconductors to be used in AI (artificial intelligence) and the 5G high-speed communication standard.

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