Siemens AG announced in an official statement on Monday that it signed a Memorandum of Understanding (MoU) with Intel Corporation on cooperation in the field of digitalization and sustainability in microelectronics manufacturing.
According to the statement, the companies will focus on developing future manufacturing, improving factory operations and cybersecurity, and supporting a sustainable global industrial ecosystem. It was also said that various initiatives, including optimizing energy management and addressing carbon footprints across the value chain, will be key areas of collaboration.
"We're proud to collaborate with Intel to quickly advance semiconductor production. Siemens will bring its entire cutting-edge portfolio of IoT-enabled hardware and software and electrical equipment to this collaboration," said Cedrik Neike, CEO of Digital Industries and member of the Managing Board of Siemens AG.
